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MSEM Faculty Honored with International Society Award

John Pan wins the William D. Ashman – John A. Wagnon Technical Achievement Award from the International Microelectronic Assembly and Packaging Society (IMAPS) 

The International Microelectronic Assembly and Packaging Society (IMAPS) awards the William D. Ashman – John A. Wagnon Technical Achievement Award to a member of the society who has made outstanding technical contributions to the microelectronics packaging industry, while participating and demonstrating support of activities to enhance the profession as a member.

The 2022 William D. Ashman – John A. Wagnon Technical Achievement Award was presented to Prof. Jianbiao John Pan by IMAPS President, Dr. Beth Keser, on October 4, 2022 during the award presentation ceremony at the 55thInternational Symposium on Microelectronics in Boston, MA, USA.

IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. IMAPS is the leading international microelectronics and packaging society representing more than 3,000 members around the world in US, European, and Asian chapters. Prof. Pan has been serving as the Editor-in-Chief of IMAPS Journal of Microelectronics and Electronic Packaging since 2012. He is a Fellow, and Life Member of IMAPS.

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